

Board Name:	LMP7721_Multi_DemoBd_REVA
Part Number:	980600409-100A
File Name:	NSC_880600409-001_REVA.zip
Revision: 	A

Layers:		2 (double sided, copper-core-copper)
Board Size: 	3.00" x 2.50" rectangular (7.5 sqin)
Board Thick:	0.062"
Board Material:	FR4 RoHS
Outer Copper:	1 oz.
Finish:		Immersion Gold
Solder Mask:	Green LPI
Silkscreen:	1 side white (top)
Non-PTH		None
Cutouts:	None
Total Holes:	33
Total Hole siz:	7
Min Hole siz:	16 mil
Max hole siz:	251 mil
Route Pts	4

STACKUP:  

 TOP LAYER	POSITIVE (trace=copper)
 BOTTOM		POSITIVE (trace=copper)

FILES:

Fab Drawing is on Drill Drwg (.GD1). Board Outline is on all layers.

------------------------------------------------------------------------------------------
Layer Extension     Layer Description                      
------------------------------------------------------------------------------------------
.GTL                Top Layer                               
.GBL                Bottom Layer                            
.GTO                Top Silkscreen                             
.GBO                Bottom Silkscreen                         
.GTP                Top Paste                               
.GBP                Bottom Paste                            
.GTS                Top Solder                              
.GBS                Bottom Solder                           
.GKO                Keep-Out Layer                          
.GM10               M10 Fab Notes                           
.GM11               M11 Gerber Information                  
.GM12               M12 Stackup                             
.GPT                Top Pad Master                          
.GPB                Bottom Pad Master                       
.GD1                Drill Drawing and Drill Table                         
.GG1                Drill Guide                             
------------------------------------------------------------------------------------------

ASCII RoundHoles File : LMP7721_Multi_DemoBd_REVA.TXT
EIA File   : LMP7721_Multi_DemoBd_REVA.DRL

Tool         Hole Size           Hole Type     Hole Count Plated       Tool Travel
---------------------------------------------------------------------------
T1        16mil (0.4064mm)         Round          14               287.31 Inch (7297.72 mm)
T2        51.18mil (1.29997mm)     Round          1                285.32 Inch (7247.04 mm)
T3        60mil (1.524mm)          Round          2                283.89 Inch (7210.93 mm)
T4        80mil (2.032mm)          Round          4                284.44 Inch (7224.83 mm)
T5        86.61mil (2.19989mm)     Round          4                286.10 Inch (7266.86 mm)
T6        120mil (3.048mm)         Round          4                291.66 Inch (7408.29 mm)
T7        251mil (6.3754mm)        Round          4                286.55 Inch (7278.40 mm)
---------------------------------------------------------------------------
Totals                                            33               2005.28 Inch (50934.07 mm)


Both Gerber and ODB++ files are provided. Netlist files are also provided in IPC and Cadnetics format.

NOTES:

Please do not "pepper" the excess copper on the board if possible - keep ground planes in tact. 

This board has a clearance area with bare copper traces between the connector and IC with silkscreen and solder masks removed. 

Bottom layer is "ground plane" - positive image in Gerbers.

Vendor marks and stamps should be placed on bottom layer of board (in copper or solder mask, but NOT in silk).


Engineer: 	Paul Grohe
Email:		paul.grohe@nsc.com
Phone:		408 721-7389 (Working Hours 8:30a-5:30p)
Cell:           408 307-5432 (After hours)
FAX		408 721-2513

Thank You
Paul Grohe