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在电路上，首先确保thermal pad充分接地（即thermal pad 与焊盘之间的焊锡足够且均匀分布），这一点很重要，因为thermal pad是芯片唯一接地的地方，然后需要保证上电时序满足datasheet中section7.7的要求。保证在VDD33和VDD电源正常之后，GRSTz的低电平时间至少为3ms.
