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设置了GAPBOND_BOND_FAIL_ACTION为GAPBOND_FAIL_TERMINATE_LINK不生效

Other Parts Discussed in Thread: CC2640R2F
问题描述:
开发板设置了GAPBOND_BOND_FAIL_ACTION为GAPBOND_FAIL_TERMINATE_LINK,手机端直接取消配对,链接没有断开(很大概率)。
从代码里看,这种情况下,没有GAP_BOND_COMPLETE_EVENT(with error code)报上来。
具体操作:
当手机端弹出配对请求,直接点取消。会发现很有大概率链接不会断开。
log截图:
可以看到手机已经回了paring failed, 且手机端已有bonding failed的event。
SDK版本:
simplelink_cc2640r2_sdk_1_40_00_45