Altium

Design Rule Verification Report

Date	:	2015/6/10
Time	:	2:03:28
Elapsed Time	:	00:00:07
Filename	:	E:\电子设计大赛\电源\交流恒流源\hardware\AC\PCB_Project\AC.PcbDoc

Warnings	:	0
Rule Violations	:	19

Summary

Warnings	Count
Total	0

Rule Violations	Count
Net Antennae (Tolerance=0mil) (All)	4
Silk primitive without silk layer	0
Silk to Silk (Clearance=0mil) (All),(All)	0
Silk To Solder Mask (Clearance=0mil) (IsPad),(All)	0
Minimum Solder Mask Sliver (Gap=10mil) (All),(All)	11
Hole To Hole Clearance (Gap=10mil) (All),(All)	0
Hole Size Constraint (Min=1mil) (Max=100mil) (All)	4
Clearance Constraint (Gap=10mil) (All),(All)	0
Un-Routed Net Constraint ( (All) )	0
Short-Circuit Constraint (Allowed=No) (All),(All)	0
Total	19

Net Antennae (Tolerance=0mil) (All)
Net Antennae: Via (6857mil,6839mil) Top Layer to Bottom Layer
Net Antennae: Via (793.5mil,6839mil) Top Layer to Bottom Layer
Net Antennae: Via (793.5mil,1184mil) Top Layer to Bottom Layer
Net Antennae: Via (6857mil,1184mil) Top Layer to Bottom Layer

Minimum Solder Mask Sliver (Gap=10mil) (All),(All)
Pad U9-6(5619.909mil,5398mil) Multi-Layer	Pad U9-7(5564.791mil,5398mil) Multi-Layer
Pad U9-4(5730.146mil,5398mil) Multi-Layer	Pad U9-5(5675.028mil,5398mil) Multi-Layer
Pad U9-6(5619.909mil,5398mil) Multi-Layer	Pad U9-5(5675.028mil,5398mil) Multi-Layer
Pad U9-3(5785.264mil,5398mil) Multi-Layer	Pad U9-4(5730.146mil,5398mil) Multi-Layer
Pad U9-2(5840.382mil,5398mil) Multi-Layer	Pad U9-3(5785.264mil,5398mil) Multi-Layer
Pad U9-1(5895.5mil,5398mil) Multi-Layer	Pad U9-2(5840.382mil,5398mil) Multi-Layer
Pad U5-3(2681.5mil,5006mil) Multi-Layer	Pad U5-4(2681.5mil,5102mil) Multi-Layer
Pad U7-2(3104.134mil,4881mil) Bottom Layer	Pad U7-1(3104.134mil,4918.402mil) Bottom Layer
Pad U7-3(3104.134mil,4843.599mil) Bottom Layer	Pad U7-2(3104.134mil,4881mil) Bottom Layer
Pad U6-2(2405.5mil,5001.866mil) Bottom Layer	Pad U6-1(2442.902mil,5001.866mil) Bottom Layer
Pad U6-3(2368.099mil,5001.866mil) Bottom Layer	Pad U6-2(2405.5mil,5001.866mil) Bottom Layer

Hole Size Constraint (Min=1mil) (Max=100mil) (All)
Hole Size Constraint (125.984mil > 100mil) : Via (6857mil,6839mil) Top Layer to Bottom Layer
Hole Size Constraint (125.984mil > 100mil) : Via (793.5mil,6839mil) Top Layer to Bottom Layer
Hole Size Constraint (125.984mil > 100mil) : Via (793.5mil,1184mil) Top Layer to Bottom Layer
Hole Size Constraint (125.984mil > 100mil) : Via (6857mil,1184mil) Top Layer to Bottom Layer