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DLPC3433 BGA封装焊盘间距太小

guobao yao
Prodigy 81 points
Other Parts Discussed in Thread: DLPC3433, DLPC3438, DLP3010, TIDA-00384

DLPC3433 BGA封装焊盘间距太小，导致在PCB LAYOUT时放置过孔后无法走线，请问在BGA扇出时应设置多大的过孔和间距以及线宽。现在PCB厂家能做的过孔最小要求0.2mm，线宽4mil，间距4mil。不知道谁用过这个IC，是如何设置的，请赐教，谢谢！