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https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/1185489/tps63810-tps63810-s-bonding-wire-material-and-chip-pin-material
大家好、
您能否提供 TPS63810YFFR_DSBGA15的键合线材料和芯片引脚材料？ 谢谢。
此致、
Charlie
您好、 Charlie、
我正在尝试了解焊丝和引脚的材料、请在此处等待我的更新。
此致
TAO
您好 Chainie、
是否与客户签订了 NDA 协议？ 否则、我们将不会分享材料的详细信息。
