Hercules™︎ 安全微控制器论坛 - 最近的话题

TMS570LC4357-SEP: Sharing Flash API Between Bootloader and Application

Bob Apple — Wed, 18 Feb 2026 18:15:24 GMT

Part Number: TMS570LC4357-SEP

Would it be possible for an application to use the F021 Flash API copied to SRAM by a bootloader (ref. spna241)?

I assume it would be if care is taken to copy the API into dedicated, shared SRAM. Otherwise:

What considerations (ex. application clock settings) are important to make this work?
Is example code available?

The goal is for both bootloader and applications to be able to update EEPROM memory.

The application could also compile with the flash API, but it uses more space and requires an additonal copy-to-SRAM step.

RE: TMS570LC4357-SEP: Sharing Flash API Between Bootloader and Application

Eirwen — Wed, 25 Feb 2026 08:54:18 GMT

Refer below FAQ:

(+) [FAQ] TMS570LC4357: How to write the data into the Flash Bank-0 - Arm-based microcontrollers forum - Arm-based microcontrollers - TI E2E support forums

Here we are storing FAPI code into Flash Bank0 but before calling its API's we moved it to the RAM and calling FAPI's from RAM.

You can follow similar procedure using your bootloader.

RE: TMS570LC4357-SEP: Sharing Flash API Between Bootloader and Application

Eirwen — Thu, 19 Feb 2026 04:02:50 GMT

Hello, we have received your case and the investigation will take some time. Thank you for your patience.

LM3485: Updated information

ELFIN JIANG — Thu, 03 Jul 2025 08:08:14 GMT

Part Number: LM3485

Hi Team.

Now add two questions
1, this model is suitable for solar photovoltaic products of this kind, the specifications did not see
2, in the material of the periphery added a 2.5 ohm series resistance (normal, not allowed), FB pin access to the MCU control signals (the original factory does not have this type of design reference), please ask whether this design is permitted, because do not add a series resistance simply test the material itself is not a problem! This is the latest update of this information!

RE: LM3485: Updated information

Vivian Gao — Tue, 22 Jul 2025 04:14:54 GMT

Do you have any update?

RE: LM3485: Updated information

Vivian Gao — Tue, 15 Jul 2025 04:41:59 GMT

In the shared waveforms, the IC _VIN levels are as follows

NG no res: 22.6V (should be with Res)

NG with res: 23.8V (should be No res)

1. Can you please double-check this? How NG with No res< NG with res?? I believe the caption is interchanged.

OK with res: 20.6V

OK no res:23.8V

2. However OK with res IC_VIN is lower i.e the drop across the series res is higher in case of OK unit wrt NG unit. Is the input current same for both units?

3. inductor current peaks seem different for OK unit and NG units. Please note the input current.

4. I noticed Q1 is NMOS in schematic. It is supposed to be PMOS. Can you please double check?

RE: LM3485: Updated information

ELFIN JIANG — Mon, 14 Jul 2025 01:17:32 GMT

There are test values, there are resistors that are IC-VIN lower

RE: LM3485: Updated information

Vivian Gao — Fri, 11 Jul 2025 01:45:54 GMT

你能否测量/保持光标在波形的最小值和最大值上？请你再检查一下NG波形。使用RES时，Vin看起来更高。

RE: LM3485: Updated information

ELFIN JIANG — Fri, 11 Jul 2025 01:38:18 GMT

你好

请问这个有进展了吗？

RE: LM3485: Updated information

ELFIN JIANG — Tue, 08 Jul 2025 01:56:40 GMT

1-Yellow: Inductor current waveform
2-Blue: DC supply 23.5V/2.1A
3-Purple: IC-VIN pin waveform
4-Green: Battery voltage waveform (13.5V)

RE: LM3485: Updated information

Vivian Gao — Mon, 07 Jul 2025 00:12:25 GMT

要了解应用程序问题，请在问题出现时捕捉波形(良品和不良品都要)

a) Vin_before 2.5 series resistor

b) Vin pin of the IC

c) Output,

d) Inductor current

当a）2.5欧姆串联电阻器未连接b）纯R负载时，问题得以解决，问题可能与应用程序相关的某些工作点有关。

TPS40210：TPS40210DGQ纹波问题

yanwei sun — Thu, 03 Jul 2025 07:29:32 GMT

Part Number: TPS40210

为什么在使用 TPS40210DGQ 时测得的输出纹波会有显著差异？一些测量值显示 20mV，而另一些则高达 200mV。

RE: TPS40210：TPS40210DGQ纹波问题

Lydia — Fri, 04 Jul 2025 07:52:44 GMT

您好，

感谢您使用 e2e 论坛。
您能否提供更多信息以了解问题？
通常情况下、输出电压纹波与输出电容、开关频率和电感器的选择密切相关、但在这里我需要更多信息来提供清晰的说明。

必要的信息将是：
-拓扑, VIN, VOUT 和负载条件
-原理图信息,如果可用
-测试条件:当您看到20mV 波纹和当您看到200mV

在此基础上、我们应该能够解释您看到的行为。

RE: LM3485: Updated information

ELFIN JIANG — Fri, 04 Jul 2025 07:11:31 GMT

在这个产品设计中。因为太阳能是给电池充电。所以需要根据电池剩余电量的情况调整电流，电压。。。所以在FB脚，接入了一个单片机的pwm信号。来调整输出的电压与电流

RE: LM3485: Updated information

ELFIN JIANG — Fri, 04 Jul 2025 07:07:57 GMT

再补充一下前面的，

稳压电源的正极，经过大电阻，连接到芯片的vin。。。（这样做的原因是，需要模拟太阳能电池板的工作。因为太阳能电池板，输出电流越高，电池内阻就会越大，分压也就越多。。。因为实际的出货测试，没有实际的光照模拟环境，只能用稳压电源+电阻的方式模拟。）

RE: LM3485: Updated information

ELFIN JIANG — Fri, 04 Jul 2025 06:19:43 GMT

添加这个电阻，是模拟太阳能板那个阻止，正常是外接一个太阳能板子的，但是测试过程，就是用这个电阻来模拟这个太阳能板

它连接在输入电源和IC的VIn引脚之间，对吗？ ——从标出来这里串联一个电阻进去

RE: LM3485: Updated information

Vivian Gao — Fri, 04 Jul 2025 06:14:54 GMT

此外，输入是什么？它来自太阳能电池板吗

RE: LM3485: Updated information

Vivian Gao — Fri, 04 Jul 2025 06:03:30 GMT

哦，好的。谢谢你的确认。你们为什么要添加电阻？它连接在输入电源和IC的VIn引脚之间，对吗？

RE: LM3485: Updated information

Vivian Gao — Fri, 04 Jul 2025 06:00:35 GMT

好的

RE: LM3485: Updated information

ELFIN JIANG — Fri, 04 Jul 2025 05:51:25 GMT

对，良品和不良品单独使用它的负载测试都是正常的，是接到电路板之后外围加了一个串联电阻之后才不良的

RE: LM3485: Updated information

Vivian Gao — Fri, 04 Jul 2025 05:47:59 GMT

您的文档里面写的良品和不良品，如果二者都用电子负载测试，都是正常的吗

RE: LM3485: Updated information

ELFIN JIANG — Fri, 04 Jul 2025 05:46:58 GMT

芯片独立使用（按规格书）输出电压正常，带载也是正常的,在主板上面，稳压电源输入23.5V，串入2.5欧姆电阻，限制电流输入2.1A, 再接到主板的供电端输出电压设置在13.8V，稳压电源显示当前电流1.6A, 去掉这个2.5欧电阻，电流就可以上升到2.1A

RE: LM3485: Updated information

Vivian Gao — Fri, 04 Jul 2025 05:12:06 GMT

Hi Jiang，

不良品用电子负载可以正常工作吗

RE: LM3485: Updated information

Vivian Gao — Fri, 04 Jul 2025 04:33:41 GMT

我帮您咨询了资深工程师，需要先看资深工程师能不能理解并复现您的问题。

我也没有办法预估他的处理时间，但是我反馈了您很着急。

RE: LM3485: Updated information

ELFIN JIANG — Fri, 04 Jul 2025 03:44:24 GMT

这个大概什么时候能回复呀，其实挺久时间了