其他微控制器论坛 - 最近的话题

TIDM-02013: Academic Inquiry: VT-20163B (WT-20163B) Integrated Magnetics for TIDM-02013

hisen he — Sat, 19 Sep 2026 12:16:06 GMT

Part Number: TIDM-02013

Hello experts

I am a postgraduate student researching the TIDM-02013 6.6kW bidirectional CLLLC OBC reference design.The magnetic component on my test board is marked WT-20163B on the aluminum housing, and it is named VT-20163B in TI documents. This magnetics is co-developed by TI and Cyntec.

For my master’s thesis, I want to verify the internal structure of this integrated transformer. This inquiry is purely for academic research, with no commercial purchasing intention.

Thank you very much for your time and support. Looking forward to your reply.

RE: TIDM-02013: Academic Inquiry: VT-20163B (WT-20163B) Integrated Magnetics for TIDM-02013

Alice — Mon, 21 Sep 2026 06:48:36 GMT

您好，

很遗憾，我们没有变压器的内部结构。

但在链接的帖子中提供了VT-20163的数据手册。

PMP22650: VI-20174A - Simulation, hardware & system design tools forum - Simulation, hardware & system design tools - TI E2E support forums

RE: TIDM-02013: Academic Inquiry: VT-20163B (WT-20163B) Integrated Magnetics for TIDM-02013

Eirwen — Sun, 20 Sep 2026 23:04:24 GMT

Hello, we have received your case and the investigation will take some time. Thank you for your patience.

RE: TIDM-02013: 电流环波形半周期丢失

Daniel — Tue, 08 Sep 2026 05:30:59 GMT

您好

我想看一下驱动控制信号变化以及反馈相关的变化。

TIDM-02013: 电流环波形半周期丢失

hisen he — Mon, 07 Sep 2026 10:56:01 GMT

Part Number: TIDM-02013

Dear Experts,

During the Lab 1 experiment, the gate drive performed normally. Afterwards, the Lab 3 current‑loop test was carried out. When only the PH1 branch was enabled with a 200 Ω load connected, the output voltage rose gradually as the current‑loop reference was increased step‑by‑step. Finally, with a current reference of 0.17 and 220 V AC input, the output voltage reached 400 V, and the power factor was higher than 0.99.

However, under identical test conditions when only the PH2 branch was enabled, gate drive signals were missing during the negative half‑cycle. Increasing the current‑loop reference failed to restore the missing drive pulses. In Figure 1, the blue trace shows the gate‑drive waveform of PH2. In Figure 2, the yellow trace denotes the input voltage and the blue trace denotes the input current. Due to this fault in the PH2 branch, the interleaved totem‑pole PFC cannot work properly.

What could be the root cause? Is it an issue with the Hall‑effect current sensor, or a firmware/code‑related problem?

This issue has troubled me for a long time. I look forward to your prompt reply. Thank you very much

RE: TIDM-02013: 电流环波形半周期丢失

hisen he — Tue, 08 Sep 2026 05:22:27 GMT

Dear Expert,

Our hardware circuit is based on TI reference design TIDM-02013. No modifications have been made to the hardware feedback and control circuits. The software current loop is implemented following the attached diagram. The hardware and software configurations of the PH1 and PH2 power paths are identical except for acceptable minor deviations. PH1 operates normally, while the PH2 path loses gate drive signals for half an AC cycle during operation.

Looking forward to your reply.

RE: TIDM-02013: 电流环波形半周期丢失

hisen he — Tue, 08 Sep 2026 05:09:53 GMT

Dear Expert,

RE: TIDM-02013: 电流环波形半周期丢失

Daniel — Tue, 08 Sep 2026 00:59:35 GMT

您好

方便分享您的实际电路图吗？以及您驱动的控制信号和反馈信号。

RE: TIDM-02013: 电流环波形半周期丢失

Eirwen — Mon, 07 Sep 2026 22:55:55 GMT

已经收到了您的案例，调查需要些时间，感谢您的耐心等待。

LM5060-Q1: LM5060-Q1

aoyang liu — Wed, 02 Sep 2026 01:01:27 GMT

Part Number: LM5060-Q1

LM5060.pdf

使用TIDA-01168中的LM5060高边驱动芯片，发现在MOS开启后拉低EN引脚输出侧还是有44V电压（MOS正常打开时输出48V），且此时可以放电，一段时间后造成MOS损坏，大概原因是MOS驱动GS在EN脚拉低后还能输出3V左右电压，此电压达到MOS的开启电压VGSTH导致MOS不完全导通。请帮忙给出解决方法。谢谢！

RE: LM5060-Q1: LM5060-Q1

Vivian Gao — Wed, 02 Sep 2026 01:26:17 GMT

感谢您关注TI产品。我们正在核实您的问题，请耐心等待我们的回复。

RE: UCC28711: internal lead-frame protrusions

Eirwen — Tue, 04 Aug 2026 08:38:21 GMT

请按照以下链接联系客户支持中心，会有客服为您提供帮助：
ticsc.service-now.com/csm

UCC28711: internal lead-frame protrusions

yueliang Ma — Tue, 04 Aug 2026 06:47:30 GMT

Part Number: UCC28711

Hi TI team,

We are currently evaluating the UCC28711DR and during our X-ray inspection, we observed some anomalies that we would like to clarify.

As shown in the attached X-ray images, there appear to be internal lead-frame protrusions on the side of the body of the device. These protrusions extend outward from the main lead-frame structure and are visible on both the top and side views under inspection.

We have highlighted the areas of concern in the images for reference. Could you please help confirm:

Are these protrusions a normal characteristic of the lead-frame design for this device?
Could they potentially impact the mechanical or electrical reliability of the part, such as the risk of short circuits or die attach integrity?
Is there any known process variation that could cause such features, and do they fall within TI's standard acceptance criteria?

Any clarification or guidance would be greatly appreciated.

Thank you

UCC28711: internal lead-frame protrusions

yueliang Ma — Tue, 04 Aug 2026 06:44:50 GMT

Part Number: UCC28711

Hi TI team,

We are currently evaluating the UCC28711DR and during our X-ray inspection, we observed some anomalies that we would like to clarify.

We have highlighted the areas of concern in the images for reference. Could you please help confirm:

Are these protrusions a normal characteristic of the lead-frame design for this device?
Could they potentially impact the mechanical or electrical reliability of the part, such as the risk of short circuits or die attach integrity?
Is there any known process variation that could cause such features, and do they fall within TI's standard acceptance criteria?

Any clarification or guidance would be greatly appreciated.

Thank you

RE: UCC28711: internal lead-frame protrusions

FRANK1 — Tue, 04 Aug 2026 08:16:12 GMT

Customer support center | TI.com

RE: UCC28711: internal lead-frame protrusions

yueliang Ma — Tue, 04 Aug 2026 08:12:43 GMT

Thank you for your reply. I followed the instructions you provided, but it appears that the current webpage structure may have changed, and I was unable to find the entry points you described. Specifically:

1. When opening `ticsc.service-now.com/csm`, the page remains stuck in a loading/redirecting state and does not display the "Request a New Support" or "Submit an Application for the Family" buttons you mentioned.
2. I also tried navigating through the "Support & Quality" section on TI.com.cn, but still could not find a submission path that matches your description.

Could you please provide an updated guide or a direct link? For example, is there a way to submit a quality-related case directly through my TI account page? Or is there an email address I can use to send the X-ray inspection results and a description of the issue to the relevant team?

I look forward to your further guidance. Thank you.

AM2432: Continuous frame loss is observed with the Enhanced Link function enabled for AM2432 EtherCAT PRU.

yijin zhao — Thu, 30 Jul 2026 12:46:33 GMT

Part Number: AM2432

The topology comprises a TwinCAT software PLC and a single device equipped with one AM2432 chip. When the Enhanced Link function is enabled, continuous frame loss may occur probabilistically after power cycling the device (the Beckhoff master cannot receive the returning data frames). This frame loss issue does not occur when the Enhanced Link function is disabled.

Investigation results are listed below:
1、When the problem occurs, the Ethernet LED remains steadily on, which means the PHY link has been established.
2、We read the ESC Port Control register (0x100) and Port Status register (0x110). The value of Port Status register 0x110 is 0x5501, indicating that the port link is not up and the port is not opened. This suggests an issue with PRU processing.

RE: AM2432: Continuous frame loss is observed with the Enhanced Link function enabled for AM2432 EtherCAT PRU.

Aaron Thomas — Tue, 04 Aug 2026 08:07:29 GMT

你好，

这是否与“回复：AM2434：AM243增强型链路通信的Ethercat问题”重复？

问候，
亚伦

RE: UCC28711: internal lead-frame protrusions

FRANK1 — Tue, 04 Aug 2026 07:06:06 GMT

The TI E2E Forum is designed to address technical issues customers encounter while designing with TI products.
Your problem is in the category of process and chip quality issues.
It is recommended that you contact Customer Support as described below and a customer service will be available to assist you.
Open the link ticsc.service-now.com/csm
Click the "Submit an Application for the Family" button under "Request a New Support"
In the newly opened window, click "Quality. "Create a case for the "Family" button under Reliability and Environmental Information
In the form that opens, you can describe your problem in Chinese and submit it.
A specialist will be at your service.

UCC28711: internal lead-frame protrusions

yueliang Ma — Tue, 04 Aug 2026 06:52:47 GMT

Part Number: UCC28711

Hi TI team,

We are currently evaluating the UCC28711DR and during our X-ray inspection, we observed some anomalies that we would like to clarify.

We have highlighted the areas of concern in the images for reference. Could you please help confirm:

Are these protrusions a normal characteristic of the lead-frame design for this device?
Could they potentially impact the mechanical or electrical reliability of the part, such as the risk of short circuits or die attach integrity?
Is there any known process variation that could cause such features, and do they fall within TI's standard acceptance criteria?

Any clarification or guidance would be greatly appreciated.

Thank you

RE: UCC28711: internal lead-frame protrusions

Taylor — Tue, 04 Aug 2026 07:01:08 GMT

Hi,

For X-ray related issues, please contact the customer service center quality department.

(+) UCC28711: internal lead-frame protrusions - 其他微控制器论坛 - 其他微控制器 - E2E™ 设计支持

RE: UCC28711: internal lead-frame protrusions

Taylor — Tue, 04 Aug 2026 06:58:16 GMT

Hi,

We have received your post and the investigation will take some time. Thank you for your patience.

RE: UCC28711: internal lead-frame protrusions

FRANK1 — Tue, 04 Aug 2026 06:47:24 GMT

Thank you for contacting TI China E2E forum and choosing our products as part of your solution. Regarding your query, please give us some time to confirm this issue.

RE: AM2432: Continuous frame loss is observed with the Enhanced Link function enabled for AM2432 EtherCAT PRU.

Lydia — Thu, 30 Jul 2026 23:19:31 GMT

Hello, we have received your case and the investigation will take some time. Thank you for your patience.

TMS320F28335: F28335MCBSP配置SPI模式数据读取发生移位问题

Guo Dzai — Fri, 24 Jul 2026 07:37:22 GMT

Part Number: TMS320F28335

近期我在Ti F28335DSP芯片上使用McBSP作为SPI MASTER使用，和对端FLASH芯片进行通信，通过读取FLASH ID来验证软件读写配置，但是发现无论怎么改配置包括但不限于CLKSTP,SPI MODE等寄存器，回读到的Bit位相较于正确值总是发生移位（左右都会有，根据软件配置不一样），例如正确要读到的FLASH ID值为 C2 20 1B，但实际读到的值为：E1 10 0D。已经困扰很久，可否还有其他思路，万分感谢

CODE:

#include "ext_flash.h"

// ========== GPIO 初始化（CS/WP/HOLD 用普通 GPIO）==========
static void Flash_GpioInit(void)
{
EALLOW;

// CS (GPIO23) - 普通 GPIO 输出
#if 1
GpioCtrlRegs.GPAPUD.bit.GPIO23 = 0;
GpioCtrlRegs.GPAMUX2.bit.GPIO23 = 0;
GpioCtrlRegs.GPADIR.bit.GPIO23 = 1;
#else
GpioCtrlRegs.GPAPUD.bit.GPIO24 = 0; // 使能上拉
GpioCtrlRegs.GPAMUX2.bit.GPIO24 = 0; // GPIO 模式
GpioCtrlRegs.GPADIR.bit.GPIO24 = 1; // 输出
#endif
// WP (GPIO25) - 输出高
GpioCtrlRegs.GPAPUD.bit.GPIO25 = 0;
GpioCtrlRegs.GPAMUX2.bit.GPIO25 = 0;
GpioCtrlRegs.GPADIR.bit.GPIO25 = 1;

// HOLD (GPIO26) - 输出高
GpioCtrlRegs.GPAPUD.bit.GPIO26 = 0;
GpioCtrlRegs.GPAMUX2.bit.GPIO26 = 0;
GpioCtrlRegs.GPADIR.bit.GPIO26 = 1;

EDIS;

FLASH_WP_H();
FLASH_HOLD_H();
FLASH_CS_H();
}

// ========== McBSP-A GPIO 复用配置 ==========
static void Mcbspa_GpioInit(void)
{
EALLOW;

// MDXA (GPIO20) - 发送数据 → Flash DI
GpioCtrlRegs.GPAPUD.bit.GPIO20 = 0;
GpioCtrlRegs.GPAMUX2.bit.GPIO20 = 2;

// MDRA (GPIO21) - 接收数据 ← Flash DO
GpioCtrlRegs.GPAPUD.bit.GPIO21 = 0;
GpioCtrlRegs.GPAMUX2.bit.GPIO21 = 2;

// MCLKXA (GPIO22) - 发送时钟
GpioCtrlRegs.GPAPUD.bit.GPIO22 = 0;
GpioCtrlRegs.GPAMUX2.bit.GPIO22 = 2;

// GpioCtrlRegs.GPAPUD.bit.GPIO23 = 0;
// GpioCtrlRegs.GPAMUX2.bit.GPIO23 = 2; // McBSP-A FSX

EDIS;
}

// ========== 延时函数（复制 TI 官方）==========
static void delay_loop(void)
{
volatile long i;
for (i = 0; i < 1000; i++)
{
asm(" NOP");
}
}

// ========== McBSP-A 配置为 SPI 主模式（Mode 0, 32-bit）==========
// 完全复制回环测试通过的配置，只改 DLB=0
static void Mcbspa_SpiInit(void)
{
EALLOW;

// 使能 McBSP-A 时钟
SysCtrlRegs.PCLKCR0.bit.MCBSPAENCLK = 1;

// 软件复位
McbspaRegs.SPCR2.all = 0x0000;
McbspaRegs.SPCR1.all = 0x0000;
//asm(" RPT #2 || NOP");
DELAY_US(10);

McbspaRegs.PCR.all = 0x0F08;

// 关闭数字回环（外部模式）
McbspaRegs.SPCR1.bit.DLB = 0;

// SPI Mode 0: CLKSTP = 2 (bit12:11)
McbspaRegs.SPCR1.bit.CLKSTP = 3;
McbspaRegs.PCR.bit.CLKXP = 1;
McbspaRegs.PCR.bit.CLKRP = 1;

// 数据延迟
McbspaRegs.RCR2.bit.RDATDLY = 1;
McbspaRegs.XCR2.bit.XDATDLY = 1;

// ========== 32-bit 字长（和回环测试一致）==========
McbspaRegs.RCR1.bit.RWDLEN1 = 0;
McbspaRegs.XCR1.bit.XWDLEN1 = 0;

// 采样率发生器
McbspaRegs.SRGR2.all = 0x2000;
McbspaRegs.SRGR1.all = 0x0008;

// 退出复位（和回环测试完全一致）
McbspaRegs.SPCR2.bit.GRST = 1;

// Enable the sample rate generator
DELAY_US(10);
McbspaRegs.SPCR2.bit.XRST = 1;
McbspaRegs.SPCR1.bit.RRST = 1;
McbspaRegs.SPCR2.bit.FRST = 1;

EDIS;
}

Uint8 ExtFlash_SwapByte(Uint8 txData)
{
// 等 XRDY
while(McbspaRegs.SPCR2.bit.XRDY == 0);

McbspaRegs.DXR1.all = (Uint16)txData;

// 等 RRDY
while(McbspaRegs.SPCR1.bit.RRDY == 0);

volatile Uint16 dummy = McbspaRegs.DRR2.all;
return (Uint8)(McbspaRegs.DRR1.all & 0xFF);
}

// ========== 初始化入口 ==========
void ExtFlash_Init(void)
{
Flash_GpioInit();
Mcbspa_GpioInit();
Mcbspa_SpiInit();
}

// ========== 读 JEDEC ID ==========
void ExtFlash_ReadID(Uint8 *pBuf, Uint8 len)
{
Uint8 i;
char buf[64];

FLASH_CS_L();
DELAY_US(10);

ExtFlash_SwapByte(FLASH_CMD_RDID);
//ExtFlash_SwapByte(0xFF);
for(i = 0; i < len; i++)
pBuf[i] = ExtFlash_SwapByte(0xFF);

FLASH_CS_H();

sprintf(buf, "JEDEC ID: %02X %02X %02X\r\n", pBuf[0], pBuf[1], pBuf[2]);
UARTa_SendString(buf);
}