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two line items for RthetaJC: one to the top of the package and one to the GND pin which includes the large thermal pad on the bottom of the package. You can consider RthetaJC(bot) 0.3 C/W to be RthetaJB (junction to bottom of package), since the GND is soldered to the board.
1，是封装的区别，BQ25672没有Junction-caso(bottom)的热阻定义，没有thermal pad
