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As this is a charge controller, the thermal dissipation/heat will be localized on the external power stage, i.e your external switching FETs and inductor. The key top optimizing thermal performance is making sure you have enough vias to ground plane for effective heat dissipation, and clean uninterrupted ground plane. With regards to choice of external components, you want to minimize
conduction loss
Choose lower DCR inductor and lower RDSon FET
switching/gate drive loss
choose switching FET with lower Qg
Some other layout suggestions:
You can improve heatsinking by adding a thicker layer of a GND copper pour
Increase the copper area of the high power traces
Reduce the effects of radiated heat by further separating the MOSFETs and inductor from each other
