TI,你好:
BQ79616-Q1的第65个焊盘引脚(即芯片肚子下面的焊盘)该怎么接?接地还是悬空?
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您好,芯片底部的焊盘是thermal pad
This package is designed to be soldered to a thermal pad on the board. See technical brief, Powerpad thermally enhanced package, Texas Instruments Literature No. SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).