SMJ320C6701GLPW14 封装类型CFCBGA 封装图纸GLP
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The GLP package was originally released with the swaged or “top hat” solder sealed lid. Several years ago it was changed to a seal ring and a welded flat lid. The drawing apparently was not updated.
The seal ring and lid configuration is the same for the GLP package ceramic flip chip ball grid array (CFCBGA) and the ZMB ceramic flip chip land grid array (CFCLGA).
This was documented in PCN 20070809002 (attached).