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TDA4VH-Q1: Thermal Simulation Failure(热仿真失败)

Part Number: TDA4VH-Q1


Hello, in the thermal simulation of the TDA4 chip, using the double thermal resistance parameters of the TDA4 chip to do thermal analysis will still have an error of 10%~30%. I hope you can provide some support: the detailed digital model of the TDA4 chip (the detailed 3D model of the chip package), or the detailed 8 thermal resistance parameters required by the delphi model of the chip, or the delphi model defined by yourselves! Thank you!