您好，在对TDA4芯片热仿真时，使用TDA4芯片的双热阻参数做散热分析任然会存在10%~30%的误差。希望您可以提供一些支持：TDA4芯片的详细数模（芯片封装的详细3D模型），或者芯片的delphi模型需要的详细8热阻参数，或者你们自己定义的delphi模型
Hello, in the thermal simulation of the TDA4 chip, using the double thermal resistance parameters of the TDA4 chip to do thermal analysis will still have an error of 10%~30%. I hope you can provide some support: the detailed digital model of the TDA4 chip (the detailed 3D model of the chip package), or the detailed 8 thermal resistance parameters required by the delphi model of the chip, or the delphi model defined by yourselves! Thank you!
