您好,芯片底部的焊盘是thermal pad
This package is designed to be soldered to a thermal pad on the board. See technical brief, Powerpad thermally enhanced package, Texas Instruments Literature No. SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004…
Other Parts Discussed in Thread: BQ79616-Q1 请注意,本文内容源自机器翻译,可能存在语法或其它翻译错误,仅供参考。如需获取准确内容,请参阅链接中的英语原文或自行翻译。 https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/1192028/bq79616-q1-bq79616-q1-sleep-mode-to-active-mode …