3次。 TI performs moisture preconditioning to the JEDEC (JSTD-020) standard which classifies the package using 3 passes of reflow to simulate the board mount and possible rework steps.
Part Number: TDA4VE-Q1
hello,
I refer to the code in path pdk_j721s2_08_06_00_31/packages/ti/csl/example/mcan/mcanEvmLoopback/mcan_evm_loopback_app_main_k3.c. I will modify the filter settings as follows, but I didn't receive any messages.
This code…
Part Number: TDA4VE-Q1 如我们所知,SoC芯片TDA4VE内部含 Main域 和MCU域,当前我不知道外部的以太网交换机SMI(MDC, MDIO)端口是连接到SoC的Main域还是 MCU域的SMI端口,同时,SoC与外部的以太网交换机之间的中断(nINT)信号,复位(nRST)信号是连接到SoC的Main域还是MCU域的GPIO口呢?选择不同的域是否会涉及到对软件的影响?期待TI专家们的回复,谢谢!
As we know, the SoC TDA4VE has main domain…