c. Connectivity相关
Sector/EE
TI Design Name
Product
MCU Value Proposition / Features utilized
Connectivity
TIDM-NFC-I2C-MODULE : NFC I2C Reader Module Reference Design ( http://www.ti.com/lit/an/sloa199/sloa199.pdf )
G2553
Low Cost, Small Form…
Other Parts Discussed in Thread: TIDM-RF430-TEMPSENSE , MSP-EXP430FR4133 , TRF7970A 请注意,本文内容源自机器翻译,可能存在语法或其它翻译错误,仅供参考。如需获取准确内容,请参阅链接中的英语原文或自行翻译。 https://e2e.ti.com/support/wireless-connectivity/other-wireless-group/other-wireless/f/other-wireless-technologies…
Other Parts Discussed in Thread: CC3200 , TRF7970A , TIDM-NFC-RW , CC3100 请注意,本文内容源自机器翻译,可能存在语法或其它翻译错误,仅供参考。如需获取准确内容,请参阅链接中的英语原文或自行翻译。 https://e2e.ti.com/support/wireless-connectivity/other-wireless-group/other-wireless/f/other-wireless-technologies-forum…
Other Parts Discussed in Thread: MSP430G2553 , MSP-EXP430F5529LP , MSP430F5529 , DLP-7970ABP 请注意,本文内容源自机器翻译,可能存在语法或其它翻译错误,仅供参考。如需获取准确内容,请参阅链接中的英语原文或自行翻译。 https://e2e.ti.com/support/microcontrollers/msp-low-power-microcontrollers-group/msp430/f/msp-low-power…