Other Parts Discussed in Thread: CC2640R2F 各位大侠好,
德州仪器最新的BLE 5 Stack,我尝试烧入CC2640R2F,但发现一个问题,BLE 5 Stack和以前的 BLE 4.2 Stack相比,占体积太大,在CC2640R2F中占据大约110-120KB的空间(Flash Programmer烧录显示有90%的有效代码)。这意味着我将几乎无法写入外部硬件的附加功能。
请问有没有办法能够缩减BLE 5 Stack的体积?期望能降低到40K以下
谢…
Other Parts Discussed in Thread: TM4C1294NCPDT 请注意,本文内容源自机器翻译,可能存在语法或其它翻译错误,仅供参考。如需获取准确内容,请参阅链接中的英语原文或自行翻译。 https://e2e.ti.com/support/microcontrollers/arm-based-microcontrollers-group/arm-based-microcontrollers/f/arm-based-microcontrollers-forum/625352…
Other Parts Discussed in Thread: CC1352P 请注意,本文内容源自机器翻译,可能存在语法或其它翻译错误,仅供参考。如需获取准确内容,请参阅链接中的英语原文或自行翻译。 https://e2e.ti.com/support/wireless-connectivity/bluetooth-group/bluetooth/f/bluetooth-forum/896329/cc1352p-flash-programmer-serial-boot-loader-api-re…
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The size of a bond record can vary from device and stack version, however you can find the size by inspecting the SNV flash page. Simply program the device and power it up. Then use Flash Programmer (version for your device) and…