我最近在用vca821做测试,发现测试过程中芯片会发烫,但是工作状态似乎有是正常的。请问这是什么原因呢?
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建议计算下结温,Tj=TA+Theta Ja*PD,其中PD为总功耗=静态功耗+输出功率
结温不能超过150度,因为这款本身高速,高电流输出,又没有thermal pad,所以合理的layout是关键。datasheet中给出了layout Recommendations。可以参考一下。