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我看的datasheet是SBOS099C − SEPTEMBER 2000 − REVISED JANUARY 2005。其中第一页的图中已经标注了OPA350的封装是DIP-8，SO-8，MSOP-8。然而在第20页DGK（S-PDSO-G8）机械数据和第22页D（S-PDSO-G8）机械数据有明显差别。以表贴的OPA350制作PCB焊盘时，究竟以哪个机械数据为准？
