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您好，请问SN65MLVD206焊接温度是多少?用机器焊接不能正常工作，人工取下，手工焊接，产品正常工作，谢谢!
器件指标书上有给出焊接工艺要求：
MSL Peak Temp
Level-1-260C-UNLIM
如果不能满足这个要求，手工焊接是有风险的。
TI 芯片的焊接曲线是完全符合Jedec 020D的要求的
看一下这个页面
http://processors.wiki.ti.com/index.php/Package_Reflow_Profiles
TI device is fully comcpliance with Jedec 020D. And for peak temp enquirt, pls refer to below link:
http://focus.ti.com/quality/docs/prdcntsearch.tsp?templateId=5909&navigationId=11220
220 C/ 235 C for devices with lead as content (pb soldering process)
250 C / 260 C for devices which are pb less (pb free soldering process)
不良率是多少，请按照JEDEC标准进行操作
