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https://e2e.ti.com/support/amplifiers-group/amplifiers/f/amplifiers-forum/1491863/lmh6644-mil-bond-ground-pad-gold-thickness
工具与软件：
我想知道 LMH6644 MDC 的接合焊盘和接地焊盘金厚度。
Brian、您好！
我将为您查看此信息、并尽快传达任何信息。 感谢您的耐心。
此致、
Ignacio
很抱歉延迟响应、我们发现厚度为0.75 μ m。
