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https://e2e.ti.com/support/amplifiers-group/amplifiers/f/amplifiers-forum/819319/tlc2274-looking-how-to-obtain-die-bonding-pad-layout-diagram-and-source-for-die-for-hybrid-packaging
了解如何获得用于混合封装的芯片的芯片接合焊盘布局图和来源
Patrick
Micross 是我们的裸片产品分销商。 有关其他信息、请参阅此处：
此致
Dennis
