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https://e2e.ti.com/support/amplifiers-group/amplifiers/f/amplifiers-forum/748913/opa2333-bare-die-version-of-opa2333-ht-solder-bumps-and-packaging
OPA2333-HT TI 器件型号 OPA2333SKGD1的裸片版本是否具有焊锡凸点或是否完全无铅？ 包装为 托盘或 磁带中的单个设备？
