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https://e2e.ti.com/support/wireless-connectivity/bluetooth-group/bluetooth/f/bluetooth-forum/942189/cc2564c-unable-to-find-bga-package-that-is-used-in-modules
我们对 TI 蓝牙芯片 CC2564C 的 BGA 封装感兴趣。 TI 网站上提供 的封装是 VQFNP-MR、它不同于 Panasonic 模块(Pan1326C-ENW89823A4KF)中使用的 BGA 封装。
让我来看看这一点、但这可能是一个芯片级封装、并未广泛提供。
此致、
特拉维斯
