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https://e2e.ti.com/support/interface-group/interface/f/interface-forum/1126454/tca6424a-thermal-information
大家好、
您能否提供 结至外壳底部/结至电路板以及 IC 的最高结温？
我发现讨论了最大 junc 温度、但它更多地涉及估算、请参阅下面的链接。
https://e2e.ti.com/support/interface-group/interface/f/interface-forum/623290/tca6424a-io-expander-power-dissipation
谢谢你。
此致、 5月
提供的值适用于 RGJ 封装：
Theta JB = 17.7C/W
Theta JC Top=14.3 C/W
-Bobby
