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https://e2e.ti.com/support/interface-group/interface/f/interface-forum/975090/sn65lvds179-junction-to-case-thermal-resistance
SN65LVDS179MDGKREP 的结至外壳热阻是多少？
您好、Tony、
我需要提交热模型请求以获取此信息。 请最多允许2周(热建模的标准提前期)来完成申请。
此致、
I.K.
结至外壳热阻为53 C/W
