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https://e2e.ti.com/support/interface-group/interface/f/interface-forum/986889/sn55lvds31-sp-junction-to-case-bottom-thermal-resistance---thermal-analysis
对于电路板级热分析、将散热焊盘焊接到 PCB 时、是否必须将焊层热阻添加到结至外壳(底部)热阻中？
谢谢你。
您好、Steve、
有关热分析问题、请 参阅我们下面提供的一些应用手册：
https://www.ti.com/lit/an/slua844b/slua844b.pdf
https://www.ti.com/lit/an/slua566a/slua566a.pdf
https://www.ti.com/lit/an/spra953c/spra953c.pdf
此致、
I.K.
