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https://e2e.ti.com/support/interface-group/interface/f/interface-forum/990841/sn65lvds31-what-are-thermal-resistances-for-sn65lvds31pw
此器件需要采用"PW"封装的结至电路板和结至底部外壳热阻。
非常感谢。
您好、Tom、
RθJB = 56.6 C/W
RθJC Ω、底部不可用。
此致、
I.K.
