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https://e2e.ti.com/support/logic-group/logic/f/logic-forum/1096941/sn74ahc04-what-should-be-the-electrical-connection-to-the-exposed-pad-on-the-package
SN74AHC04RGYR采用VQFN封装，中间带有裸露的垫。 是否可以将裸露的电极片接地？
是的；请参阅 [FAQ]在哪里连接逻辑QFN设备的散热垫？
