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https://e2e.ti.com/support/logic-group/logic/f/logic-forum/1279695/sn74lvc1g97-q1-junction-to-case-thermal-resistance-data-rjc
请提供器件 SN74LVC1G97QDBVRQ1的结至外壳热阻数据(RJC)、以帮助进行热建模：
尊敬的 Kiran：
我必须提交一份请求。 这需要大约2周时间。
