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[参考译文] MSP430F2274：在49DSBGA 封装上寻找 PCB 布局、此封装的间距为0.4mm BGA。

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Other Parts Discussed in Thread: MSP430F2274

请注意，本文内容源自机器翻译，可能存在语法或其它翻译错误，仅供参考。如需获取准确内容，请参阅链接中的英语原文或自行翻译。

https://e2e.ti.com/support/microcontrollers/msp-low-power-microcontrollers-group/msp430/f/msp-low-power-microcontroller-forum/833920/msp430f2274-looking-for-pcb-layout-on-49dsbga-package-which-is-0-4mm-pitch-bga

器件型号：MSP430F2274

需要使用 MSP430F2274并采用49DSBGA 封装的0.4mm 间距 BGA 的参考设计或评估板。  这会导致 PCB 布局出现一些问题。