你好,我目前使用TI MSP430F5172 RSB40封装的单片机,参考了开发板电路进行设计。现由于板子面积太小,想问一下VCC引脚的退耦电容能省略一些吗? 只用一只0.1uF行不行啊?
还有DataSheet上的此种封装在PCB设计时底下必需有散热孔或散热焊盘吗?
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你好,我目前使用TI MSP430F5172 RSB40封装的单片机,参考了开发板电路进行设计。现由于板子面积太小,想问一下VCC引脚的退耦电容能省略一些吗? 只用一只0.1uF行不行啊?
还有DataSheet上的此种封装在PCB设计时底下必需有散热孔或散热焊盘吗?