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BQ27546-G1芯片的封装为1.96*2.64mm，该封装很小，并且有15个引脚，无法手工焊接，请问该芯片在BQ27546EVM开发板上是如何焊接的？采用什么工艺？普通的贴片工艺能否安全的焊接？
这个是BGA封装的。手工焊接很难的
用回流焊吧
