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正如标题所说，如何考虑TPS5430的热损耗并进行设计
HI
按照datasheet layout推荐，借助芯片底部Powerpad充分与GND充分焊接，通过扩展GND面积，将GND铜箔当作散热片散热。
那类似于开关损耗这样的热损耗如何查看呢
Hi
内置开关，很难准确计算功耗，可以借助TI的在线仿真webench确认功耗大小，然后按照热阻计算温升。
