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bq25504PCB布线

Other Parts Discussed in Thread: BQ25504

请问BQ25504 QFN封装在PCB布线时,芯片背后的散热板(thermal pad)对应的PCB板区域是否要布设焊接区?这个散热背板是否需要接地?在BQ25504 PDF 文档里面的上图中,背板上面那些孔是散热的过孔吗?右上角那幅图背板分为四块是什么意思?