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我们用TLV761来代替LM1117，对比参数发现TLV761的热阻温度高很多，Junction-to-ambient thermal resistance高达165.7°/W，而LM1117仅为61.6°/W，其他部位的温度也有差异，请问这影响替代吗
Hi
影响的，你需要确认在现有条件下芯片功耗参数的温升（在热阻165.7°/W）是否仍在芯片推荐范围内（事实上不建议超过100℃甚至更低，过高温度会增加芯片失效率）
