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电机驱动芯片散热的pad 是要连接到AGND或 GND还是什么都不接呢？如DRV8412。
散热焊盘下面铺相同面积的铜到地平面，AGND和GND最后也是需要磁珠或0ohm电阻接到一起的，实现单点接地，你可参考下面这篇关于power pad PCB的布局规则：http://www.ti.com/lit/an/sloa120/sloa120.pdf
