我使用OPA627(SOIC8封装),验证功能正常,但是其发热严重,把手指压在芯片上,烫手。不知道有什么办法能解决,或者更换芯片
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我使用OPA627(SOIC8封装),验证功能正常,但是其发热严重,把手指压在芯片上,烫手。不知道有什么办法能解决,或者更换芯片