TI开发板所用高频材料RO4835采用的介电常数是3.48，
但是我们咨询了罗杰斯，他们建议RO4835采用介电常数3.66进行设计。
天线工程师的考虑是什么，因为我用两种仿出来差距很大
TI开发板所用高频材料RO4835采用的介电常数是3.48，
但是我们咨询了罗杰斯，他们建议RO4835采用介电常数3.66进行设计。
天线工程师的考虑是什么，因为我用两种仿出来差距很大
你好，
请参考RO4835LoPro 板材手册，有以下一段描述。
Typical values are a representation of an average value for the population of the property. RO4000 LoPro laminates use a modifi ed version of the RO4000 resin system to bond reverse treated foil. Values shown above are for RO4000 laminates without the addition of the LoPro resin. For double-sided boards, the LoPro foil results in a thickness increase of approximately 0.0007” (0.000018mm) and the Dk is approximately 2.4. Therefore, design Dk is highly dependent on core thickness. For specifi cation values contact Rogers Corporation or visit the Rogers Technology Support hub at 
.
[1] The IPC clamped stripline method can potentially lower the actual dielectric constant due to presence of airgaps between the laminates under test and the resonator card. Dielectric constant in practice may be higher than the values listed.
[2] The design Dk is an average number from several different tested lots of material and on the most common thickness/s. If more detailed information is required please contact Rogers Corporation. Refer to the Design DK technical articles and presentations available at , the Rogers Technology Support Hub.
[3] ** Note on 94V-0 ** RO4350B LoPro laminates do not share the same UL designation as standard RO4350B laminates. A separate UL qualifi cation may be necessary
