DLPA200的inrush电流问题

输入典型值200mA即可.
1A时间大约10uS.按照TI的参考设计来.
注意DLPA200的底部散热焊盘不能接地的.

The DLPA200 package should be thermally bonded or soldered to an external thermal pad on the PWB
surface. The recommended dimensions of the thermal pad are 10 x 10 mm centered under the part. The
metal bottom of the package is tied internally to the substrate at the VRESET_RAIL voltage level.
Therefore, the thermal pad on the board must be isolated from any other circuit or ground and no
circuit vias are allowed inside the pad area. Thermal pads are required on both sides of the PWB,
which are connected together, through an array of 5 x 5 thermal vias, 0.5 mm in diameter. Thermal pads
and the thermal vias are connected to VRESET_RAIL and isolated from ground, or any other circuit. An
internal P12V or VBB plane should be located directly underneath the top layer and have an isolated area
under the DLPA200. This isolated area must be a minimum of 20 cm2 and connect to the thermal pad of
the DLPA200 through the thermal vias. The potential of the isolated area will also be at VRESET_RAIL.
The internal ground plane should extend under the DLPA200 to help carry the heat away.