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现场返回多片ISO1176,
1. 经测试 between GND2 (pin9/15) and VCC2(pin16) is 79.8Ohm,82.8Ohm, 作为比较, 正常芯片的这两个阻抗约为82KOhm.
2. 1A/B通讯口对GND2仍有兆级阻抗(0.8M/1.09M), 作为比较, 正常芯片的这两个阻抗约为1.8M.
问题:
1. 由上可以判断1A/B通讯口并未损坏(由于GND2-VCC2阻抗异常, 导致1A/B-GND2阻抗变小), 过压应该是从VCC2和GND2端口引入?
2. 请问导致这种EIPD故障的, 除了VCC2/GND2这两个端口过压, 还有其他可能吗?
1. ISO1176是隔离的, 两侧的电源供给也是隔离的, 应该是没有回路会导致共模电压超范围?
2. 请问还有什么原因导致芯片VCC2-GND2接近短路? 谢谢!