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物料 TCAN332DR D/C:2030+5 我司在贴片后使用过程中出现不通讯现象！切不良率达到了20%，未焊接芯片单独通过第三方测试也同样复现此问题,
附件付检测报告，请帮忙分析出现此问题的原因，谢谢
157135 TCAN332DR FT CN.pdfDECAP 157135 TCAN332DR 中文.pdf
