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DP83867IR: DP83867 PHY VQFN package maximum pressure specification
How about DP83867 PHY VQFN package maximum pressure specification?
The maximum pressure is normal to package and uniform distribution which can not damage package and solder ball.
Our application will be put thermal interface material between DP83867 and metal housing to conduct heat to metal part. Since thermal interface material will be compressed, so pressure will also applied on DP83867 package.
