As described in zhct070a(logic guide 2014 ) article, LSF series support hot swap. While the LSF series is not described in the article of sdyu001ab-(logic guide rev.ab).
Now, we are designing a system with a mother card and a daughter card. We have to seperate the bus of MDC MDIO with a connector.
We want to use two LSF0102 ,one work as a level translator on the daughter card, the other work as a buffer on the mother card.
The contact sequence of connectors is GND,signal, Power(the power is not supplyed for the daughter card when the contact happened,but the mother card is still working with powered).
Then, do we need to add any other protection component on the bus?
Additional question: When design for hot swapable circuit, do we need to concern about ESD or Surge besides Ioff,PU3S,Bias VCC,Pre-charge circuit.
How to select the logic IC for the hot-swapable circuit?
