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https://e2e.ti.com/support/amplifiers-group/amplifiers/f/amplifiers-forum/657108/tle2061m-thermal-impedance-data
您好，
您能否提供TLE2061MD的以下热阻抗数据？
1.连接至导线的接头(引脚4和引脚7)
2.接线盒(塑料体)
谢谢！
Shihab。
您好Shihab：
1.接线端子至导线(引脚4和引脚7)-对于TLE2061MD，8引脚SOIC封装，未指定或测量此值
2.接线盒(塑料主体)- Θjc≈38.3 °C/W
此致，Thomas
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