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https://e2e.ti.com/support/amplifiers-group/amplifiers/f/amplifiers-forum/781437/ths4521-thermal-resistance-from-junction-to-bottom-of-case
您好！
请提供 THS4521 (DGK)封装从结点到外壳底部的热阻。 数据表中列出了一个大小为115.3°C/W 的 RJB 值、我想使用填充不足来提高热性能。 我需要知道案例底部的阻力、以支持我的分析。
谢谢、
HSG
