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https://e2e.ti.com/support/microcontrollers/arm-based-microcontrollers-group/arm-based-microcontrollers/f/arm-based-microcontrollers-forum/1547863/am2631-am263p4acokfzczrq1-need-part-lead-finish
工具/软件：
请提供以下器件的引脚镀层
尊敬的 Budesh：
焊球材料为 焊接 M705。 如果您需要更多信息、请告知我们。
谢谢、
Tejas Kulakarni
