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[参考译文] TL16C2550:VQFN 封装上散热焊盘的连接。

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https://e2e.ti.com/support/interface-group/interface/f/interface-forum/1047869/tl16c2550-connection-of-the-thermal-pad-on-vqfn-package

器件型号:TL16C2550

VQFN 封装外露焊盘是否在内部连接、是否应在布局中连接到 GND?  

 应用报告 slua271B 中似乎就是这种情况、但需要对此器件进行确认。
www.ti.com/.../slua271b.pdf