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https://e2e.ti.com/support/interface-group/interface/f/interface-forum/693539/ds90cf386-bga-package-layout-guide-with-via
您好、专家、
我们是否有关于需要板载过孔的 BGA 封装布局指南？
有一个应用手册讨论了布局指南、但它并未涵盖板载 Vias 的设计。
谢谢。
周
