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https://e2e.ti.com/support/logic-group/logic/f/logic-forum/1044277/sn74lvc1g08-q1-soldering-and-reflow-profiles
您好！
对于 SN74LVC1G08-Q1、是否建议 回流焊曲线可参考以下文档？
https://www.ti.com/lit/an/spraby1a/spraby1a.pdf?ts=1634108230546&ref_url=https%253A%252F%252Fwww.ti.com%252Fsitesearch%252Fdocs%252Funiversalsearch.tsp%253FlangPref%253Den-US%2526searchTerm%253Dreflow%2Bsoldering%2526nr%253D3559
谢谢！
Jeff
尊敬的 Jeff：
是的、这是我要使用的基准。 封装选项附录中的数据表末尾提供了每个器件的峰值回流温度。
